Education Ph.D.
Materials Science,
Colorado School of Mines, 1990
M.S.
Metallurgy,
University of Utah, 1987
B.S.
Materials Science & Engineering, University of Utah, 1986
Minors: Chemistry, Physics, Chinese Language
(Mandarin).
Academia Research
Associate Professor,
University of Utah, SLC, Department of Mech. Engineering,
Adjunct
Associate Professor, Department of Electrical & Computer Engineering
Associate Director, Utah Nanofab (Cleanroom, Surface Analysis & nano-Scale Imaging)
Research ¥ Keck Education Grant for developing modules to teach
intuitive scaling engineering using MEMS
¥ Chip Scale Package (CSP) design & reliability by classical thermal and unique tri-axial bending
¥ Biomimetic MEMS lens / iris for microcamera applications (UURF/TCP)
¥ Center
for Interdisciplinary Arts and Technology: the Utah MEMnagerie––Kinetic
Micro SculptureTM
¥ Charge-pumped MEMS actuation http://www.nanofab.utah.edu/index/about-us/cool-stuff
Industry Bourns,
Inc. Logan, UT; Ogden, UT; Cork, IR
Principal Engineer, CSP Process
Development,
Program Manager, Microelectronics Division
VLSI Technology, Inc., San Jose, CA
Staff
Development Engineer, Technology Development Division
Analytical
/ Materials Engineering Supervisor/Manager
Staff R&QA Engineer
IBM Corporation, Boulder, CO (now
LEXMARK Int'l, Inc.)
Graduate
Research Intern
Teaching &
etc. Fall Õ09 Volunteer Instructor, Salt Lake Institute
of Religion (UofU), Rel 430 Doctrines of the
Gospel
2006-12 Volunteer coach, Science Olympiad; 2012 State Director, Utah Science Olympiad
1981-83 Volunteer
LDS missionary serving in Taipei, Taiwan
2002-09 Developed
course in Microsystems Design and Characterization, cross-listed in ME, ECE, MetE, BioE, ChE,
MSE (Design
for reliability and practical techniques for physical characterization)
Co-developed
grad (IGERT) courses in Creativity, Teamwork, Communication, Leadership &
Ethics (two years)
Co-developed
course in Practical Scanning Electron Microscopy
Co-developed
freshman course in Foundations of Microsystems
2007-2013 Co-developed
course Heterogeneous Microsystems Technology; Sandia MEMS projects
Invited ÒUSTAR /
U of U / COE Partnerships to Spur R&D in micro/nano
Materials & SystemsÓ, USTAR Confluence: Where Research Meets
Lectures Commercialization,
SLC UT, 3-4 Nov, 2014
ÒUtah's
Nanofab: The Machine Shop of the FutureÓ, Keynote
lecture for Northrop-Grumman Engineering Week, SLC, 22 Feb, 2013
ÒTeaching
Scaling Engineering using MEMSÓ, Utah Science TeacherÕs Association, 8 Feb,
2013, Provo
ÒRunning
Science Olympiad in your school––and staying saneÓ, Utah Science
TeacherÕs Association, 8 Feb, 2013, Provo
ÒUniversity
of Utah MRSEC Shared Facilities: an overview of the Utah NanofabÓ,
Presentation to the MRSEC Shared Facilities Workshop,
Northwestern University, Chicago, November 1-2, 2011
ÒMEMS Actuation: Kinetic Micro
Sculpture" Presented to the BYU Graduate Seminar, Department of Mechanical
Engineering,
Provo,
11/03/08
ÒBroadly
building Utah's technology workforce training pipelineÓ, White Paper prepared
by an ad-hoc committee (T. Kar, J.
Andrade, J. Gardner, T. Goetz, G. Hansen, V. Itamura,
C. Sanders) for nanoUtah 2008, Presented by IR Harvey
10/16/08
ÒCharge-Pumped
MEMS ActuationÓ, Invited lecture to Sandia National Labs University Alliance,
Albuquerque, NM, 4/1/08
ÒMicrosystems: A career and a
vehicle promoting engineeringÓ Graduate Seminar, University of Utah,
Department
of Metallurgical Engineering, Jan 23, 2008
ÒCorrelation of CSP Bending
Fatigue in a Cell Phone to a Unique Predictive Cyclic Bending TestÓ,
Graduate
Seminar, University of Utah, Department of Metallurgical Engineering, 30
October, 2002
ÒBoard
Design, Construction, and Assembly Considerations for the Transition to Chip
Size PackagingÓ,
HDI
workshop, Phoenix, AZ, 23 Aug., 1999
"New
Paradigms and Conclusion Metrics in Value-Added Failure Analysis", Front
Range
Failure Analysis InfoExchange, Louisville, Colorado, Sept.
30, 1994
"Micromachining
and Microsurgery: Future Directions at VLSI". Invited workshop presentation for ASM/ISTFA
'93, Los Angeles.
"Micromachining
and Microsurgery Using a Seiko SMI-8100 Focused Ion Beam Milling Machine"
ASM/ISTFA '92, Los Angeles.
Hobby Activity Well, Dr.
Nibley, I do have a suggestion: Always believe God; Always disbelieve
Satan; Sunstone, 183, Winter 2016, pp
11-15
Satan Gets to Reign BAD THINGS HAPPEN God
Gets the Blame; Outskirts Press, 2017, ISBN 978-1-4787-9022-8
The
Lineage of the Lie – Revealing PaulÕs Man of Sin; Outskirts Press, 2018, ISBN 978-1-4787-8642-9
Blurring the Lines: Inclusiveness Between
Mainstream Christians and Mormons; Sunstone Summer Symposium (session 166),
July 27, 2017, University of Utah, Salt Lake City
The Moral Agency Blueprint vs. the Doctrine
of Privation; Sunstone Summer Symposium (session 214), July 28, 2017,
University of Utah, Salt Lake City
Invited Papers I.R. Harvey, A. L.
Hogan, K. R. Ford, R. Boutte and B. Baker, ÒCharge Pumped MEMS Actuation for High Force and Large
DisplacementÓ (ISSN: 2306-8515, e-ISSN 1726-5479) Sensors
& Transducers, Vol.183, Issue 12, Dec. 2014, p. 60
I.R.
Harvey, J. Ortowski, D. Turner, C. Herbert,
ÒEmpirical Strategy for Characterizing and Minimizing Effects of
Flexure-Induced Tensile Stress in CSP'sÓ, IntÕl J. Mic. Elec. Pack. issue IV,
vol. 23, No. 4, 2000
Best US Tech M.R.
Larsen, I.R. Harvey, D. Turner, B.
Porter, J. Ortowski, ÒMechanical Bending
Technique For Determining CSP Design and
Paper Runner-up Assembly
WeaknessesÓ, Proceedings APEX 2004, Anaheim, CA
Presentations I.
R. Harvey, F. Solzbacher, B. Gale, T. Parks, R. Brown,
USTAR / U of U / COE Partnerships to Spur
R&D in micro/nano Materials & Systems, COMS / NanoUtah SLC 15 October, 2014
B.
Baker, I.R. Harvey, B. Gale, J. Thomas, B. Tran, Product Innovation on the Microscale: Using
Tiny Devices to Teach Creative Solutions
to Big Problems COMS / NanoUtah SLC 14 October,
2014
T.
Dallas, M. Pleil, B. Baker, H. Stalford,
M. De Boer, I.R. Harvey, The MEMS
University Alliance: Education and Research Collaboration
in Microsystems, COMS / NanoUtah SLC 15 October,
2014
I.
R. Harvey, A. L. Hogan, K. R. Ford and B. Baker, Charge Pumping for
High-force, large-displacement MEMS and a vision for charge scavenging and storage infrastructure,
Micro/Nano TechConnect World, June 15-19, 2014, Washington DC
A. Hogan, B. Baker, C. Fisher, S. Naylor, D Fettig, I.R. Harvey, Biomimetic Accommodating Lens with
Implementation in MEMS
MOEMS/MEMS SPIE Photonics West, San Francisco,
CA, 21-26 January, 2012
A. L.
Hogan, K. R. Ford and I. R. Harvey, "Out-Of-Plane MEMS Actuation Using a
Scanning Electron Microscope," in ASME 2012 International Mechanical
Engineering Congress & Exposition, Houston, Texas.
A. L.
Hogan, M. Frerck, J. Passman,
M. P. Benardi, M. Short, J. Campbell and I. R.
Harvey, "Audiovisual Enhancement through MEMS Micro Camcorder,"
Sandia University Alliance Design Competition, Albuquerque, NM , 2012.
Brian
Baker, Austin Welborn, Ian Harvey, MEMS MicroBarbershop white paper; Sandia National Laboratories
University Alliance Design Competition MEMS Educational Design Category winner,
April 5 2010, Sandia Labs, Albuquerque, NM,
IR
Harvey and Brian Baker, ÒMEMS and SEM: Outreach tools for the nanotech eraÓ, COMS
2010, Albuquerque, September 2010
Kathryn
Ecsedy and Ian Harvey, An Exploration of the Artistic
Applications of MEMS: Gallery on a Chip, presented at The 6th International
Conference on Technology, Knowledge and Society, Berlin, 15 January, 2010.
A. L.
Hogan, A. Paulsen, B. Baker and H. I. R., "Quantifying micro Charge Pump
Actuation and off-chip manipulation using SUMMiT VTM,"
Sandia University Alliance Design Competition, Albuquerque, NM, 2009.
IR
Harvey, P. Stout, A. Hogan, K. Ecsedy, K. Ford, A.
Paulsen, ÒUtah Memnagerie: Kinetic Micro SculptureÓ
When Art Meets
Science:
Research Presentations and Performances by the 2009 CIDAT Fellowship
Recipients, 5/1/09 New Media Wing, U of Utah
A. L.
Hogan, C. Allan, S. Horschel, G. Liddiard,
D. Erickson, F. Mohammed, T. Meacham, B. Baker and I. R. Harvey,
"University of Utah Force and Vacuum Contactless Switch Characterization
chip using SUMMiT-VTM" Sandia
University Alliance Design Competition, Albuquerque, NM, 2008.
A. L.
Hogan, S. Brumbaugh, E. Anderson, G. Anderson, C.
Allan, S. Horschel, G. Liddiard,
T. Anderson, T. Meacham, B. Baker and I. R. Harvey, "The Utah MEMnagerieTM demonstrating Kinetic uSculpture and practical MEMS actuation using SUMMiT VTM" Sandia University Alliance
Design Competition, Albuquerque, NM, 2008.
Larsen,
M. R., Harvey, I. R., Curtis, A., Tessier, T., ÒBend
Testing Direct Attach Bump Architectures with Stress Mode Correlated to Field-Wearout in Handheld Application,Ó IMAPS 2008 - 41st
International Symposium on Microelectronics, Providence, RI, pp. 190 to 197,
Nov. 2008.
S. Leelavanichkul, J. Mehta, R. Boutte,
I. Harvey, and F. Solzbacher; ÒDesign of a
Micro-Integrated Optical MEMS for Camera ApplicationsÓ, Opto
98, Nurnberg, Germany, May 4, 2008
I.R.
Harvey, K.S. Udell, P. Tikalsky,
N. Cotter, G. Silcox, D. Leonard, ÒRecruiting Science
Olympiad: Low-hanging (pre-engineering) fruitÓ, April 28, Ô07 Rocky Mountain
Chapter, American Society for Engineering Education, Provo UT
Ian
Harvey, T. Kar, J. Andrade, J. Gardner, T. Goetz, G.
Hansen, A. Herd, V. Itamura, M. Robinson, C. Sanders,
Preparing for Nanotech Manufacturing: Broadly building Utah's technology
workforce training pipeline, 28 November 2007, a White Paper proposal to the
State of Utah, prepared by an ad-hoc nanoUtah 2007 committee
invested in Utah's people and nanotechnology
Ian R.
Harvey, Kent S. Udell, Planning for Utah Economic
Competitiveness: ÒTop-10 in the Nation in Science / Engineering EducationÓ,
White Paper presented to USTAR Executive Director, 22 June, 2007
I.R.
Harvey A SUMMiTTM-based MEMS design for
in-SEM actuation: a qualitative proof-of-concept for dynamic MEMS outreach
demonstrations White paper
supporting the University of Utah submission to the 2007 Sandia University
Alliance Design Competition
I.R.
Harvey, M.R. Larsen, D.Turner, I. Doyle, J. Somers, J.Ortowski, ÒEvaluation of Solder-to-Chip Attachment,
Wafer-Level Bumping Architectures: II. Performance in BHT, Cyclic Mechanical
Bending and Temperature CyclingÓ, presented in the 2005 TMS Annual Meeting
& Exhibition, San Francisco, February 13-17, 2005
Publications A.
Mondal, B. Baker, I. R. Harvey and A. P. Moreno, "PerFlexMEA: a thin microporous
microelectrode array for in vitro cardiac electrophysiological studies on
hetero-cellular bilayers with controlled gap junction communication", Lab
on a Chip, 2015, Advance Article, DOI: 10.1039/C4LC01212G
A.L.
Hogan, K.R. Ford, and I.R. Harvey, Out-Of-Plane MEMS Actuation
Using A Scanning Electron Microscope, Proceedings of the ASME 2012
International Mechanical Engineering Congress & Exposition IMECE2012
November 9-15, 2012, Houston, Texas, USA IMECE2012-88128
Kathryn
Ecsedy, Ian Harvey, Alex Hogan, Kurtis
Ford, Brian Baker, Paul Stout, Solomon Brumbaugh,
Jacob Piatt, ÒAn Exploration of the Artistic Applications of MEMS: Gallery on a
Chip ÒThe International Journal of Technology, Knowledge and Society, Volume 6,
Number 1, 2010, http://www.Technology-Journal.com, ISSN 1832-3669
Mark A.
Eddings, James Stephenson, and Ian Harvey, A Hands-On
Interactive Freshman Level Survey Course Designed to Steer Undergraduates into
Microsystems Coursework and Research, IEEE Transactions on Education, vol 52 #3, Aug 2009, 312-317
A. Hogan, E. Anderson and I.R. Harvey, Investigation
of Charge Pumped MEMS Actuation, The U of U Undergraduate Research Abstracts, Sp 2009, Vol 9., p.27, p. 120
D. Blanchard, P. M. Ligrani,
B. Gale, I. Harvey, Micro-Structure Mechanical Failure
Characterization Using Rotating Couette Flow in a
Small Gap, J. Micromech. Microeng.
15 (2005) 792–801 doi:10.1088/0960-1317/15/4/017 pp
792-801
I.R. Harvey, M.R. Larsen, D.Turner,
I. Doyle, J. Somers, J.Ortowski, ÒEvaluation
of Solder-to-Passivation Attachment as a Wafer Bumping Architecture: I. Insulating PropertiesÓ, 2004 Workshop
on Microelectronics and Electron Devices (WMED 2004), Boise ID
T. Ameel, B. Gale, I.
Harvey, ÒA Three-semester Interdisciplinary Educational Program
in Microsystems EngineeringÓ, Proceedings of the 2004 American Society for
Engineering Education Annual Conference & Exposition , SLC, 2004
I.R. Harvey, M.S. Miller, S. Blair, T. Ameel, B.K. Gale T. Ring, ÒBuilding Academic,
Research, and Commercialization Programs in Micro and Nano Science and
Engineering at the University of UtahÓ, 15th Biennial
University/Government/Industry Microelectronics Symposium, IEEE/EDS, Boise, ID,
6/30-7/2/03
I.R. Harvey, M.R. Larsen, J. Somers, I. Doyle, ÒCorrelation
of CSP Bending Fatigue in a Cell Phone to a Unique Predictive Cyclic Bending
TestÓ, Proc. IEEE/EDS workshop, Boise ID, 25 October, 2002
I.R. Harvey, J. Ortowski,
D. Turner, C. Herbert, ÒOptimization Case Study of CSP Temperature
Cycle and Board Bending ReliabilityÓ, APEX 2001, Jan. 16-18, San Diego, CA
I.R. Harvey, J. Ortowski,
D. Turner, C. Herbert, ÒStrategy for Characterizing and Minimizing
Effects of Tensile Stress in CSPÕs as Induced by Board FlexureÓ, IMAPS 2000,
Sept. 20-22, Boston, MA (won Outstanding
Paper award for the Conference)
I.R. Harvey, J. Ortowski, D. Turner, C
Herbert,
ÒEffects of Thermal Shock- or Flex-Induced Tensile Stresses in CSP'sÓ, Proc. 2000 Euro IEEE CPMT, Cork,
Ireland, 8-9 May, 2000
I. R. Harvey, J.Ortowski,
D.Turner, C.Herbert. ÒReliability Considerations for the
Transition to the Chip Size PackageÓ, Proc. APEX '00, Long Beach, CA, March
14-16, 2000, P-AD2/4, pp. 4-1 to 4-9
S. Bothra, I. Harvey and M. Weling, "A
Model and Methodology for Optimization of Spin On Dielectric Etchback Process," Proc. of VLSI Multilevel
Interconnect Conference, Jun 1996.
W. Tsai, G. Mueller, R. Lindquist, L. Li, B.
Frazier, V. Vahedi, I. Harvey, and C. Gabriel, "High
Selectivity Plasma Etching of Silicon Dioxide with a 27/2 MHz Capacitive RF
Discharge," 1996 Dry Process Symposium.
Milind Weling and Ian Harvey,
"Optimization of a Deep Sub-Micron Via Etch and Strip Process
Stopping on TiN," Electrochemical Society, 189th
Mtg. Los Angeles, CA, May 1996.
Subhas Bothra, Ian Harvey and
Milind Weling, "Process
Control for Variable Pattern Density Effects During SOG Etchback,"
Proc. of Dielectrics for ULSI Multilevel Interconnect Conference, pp. 175-178,
Feb. 1997.
S. Bothra, D. Pramanik, L.Q. Qian, I. Harvey,
D. Baker, M. Weling, S. Sethi,
C. Gabriel, S. Sengupta, H. Sur, & X.W. Lin, "Integration
of 0.25 um Three and Five Level Interconnect System," Proc. of VLSI
Multilevel Interconnect Conf., June 1997, pp. 43-48.
Randy Solis, Ian R. Harvey, and Calvin T.
Gabriel, "Novel CF4+H2O Ashing
Process for Reduction of Via Resistance," Proc. 6th Intl. Symp. on Semicond. Mfg., 1997.
I. R. Harvey. ÒNew Paradigms Driving Customer Satisfaction
and Optimum Resource Utilization in Failure AnalysisÓ, Proc. ASMI/ISTFA '94,
Los Angeles, CA, Nov. 15, 1994
I.
R. Harvey.
ÒElectrolytic Metal Migration: An Infant Mortality Mechanism in a High
Pin Count HPPPGA PackageÓ, Proc. ASMI/ISTFA '94, Los Angeles, CA, Nov. 15, 1994
I.
R. Harvey. The
Optimizing of Oxidation Parameters for Alleviating Dark Voltage Decay in
Vacuum-Metallized Photoconductor Ground Planes, Doctoral Dissertation in
Materials Science, CSM, Golden, Colorado, 1990.
I.R. Harvey, J. G. Byrne. "Effect of Hydrogen in Plastic
Zones of Single-Edge Notch HSLA Samples," in Review of Progress in Quantitative
Nondestructive Evaluation, Vol 8-B, Plenum, New
York, 1989, pp. 1779-1786.
I. R. Harvey. Positron Doppler Studies of Hydrogen in Plane Stress Plastic Zones in an HSLA Steel, M.S. Metallurgy, U of U 1987.
Patents 28 US patents awarded comprise a
mix of solo and cooperative efforts with colleagues, lab techs, equipment
techs, superiors and subordinates.
Patent
number |
Issued
Date |
Inventors |
Title |
9,448,195 |
20 Sept., 2016 |
A.P. Moreno, G. Goldberg, A. Mondal, I.R.
Harvey, B. Baker |
Electrophysiological Recording System
and Methods of Using Same |
8,842,372 B2 |
23 Sept., 2014 |
Fisher, Charles; Harvey, Ian R.; Brian W. Baker |
Lens Actuator |
8,421,305 |
16 April, 2013 |
Harvey,
Ian R.;
Meacham, Taylor M.; Boutte, Ronald W.; Baker, Brian
W.; Harvey, Iain E. |
MEMS Devices And Systems Actuated By An Energy
Field |
WO/2008/121845 |
9 Oct 08 |
Boutte, Ronald W.; Solzbacher,
Florian; Harvey, Ian R.; Horn, Justin
A.; Meacham, Taylor M.; Gaskin, Nathaniel C. Baker, Brian W. |
Micro-Deployable Devices And Systems |
WO/2008/092132 |
7/31/08 |
Bamberg, Eberhard;
Rakwal, Dinesh, R.; Jorgensen, Dean; Harvey, Ian, R. Free, Michael, L.; Balaji,
Alagar, K. |
Systems And Methods For Recycling Semiconductor
Material Removed From A Raw Semiconductor Boule |
D569,051 |
5/13/08 |
Harvey,
Nephi & Ian
(of Kaysville), Malcolm (Hyde
Park), Chris Smith (N. Salt Lake) |
RFID animal ear tag |
6,309,948 |
10/30/01 |
Lin;
Xi-Wei
(Fremont, CA); Lee; Henry (San
Francisco, CA); Harvey; Ian R.
(Kaysville, UT) |
Method for fabrication of a semiconductor device |
6,249,039 |
6/19/01 |
Harvey;
Ian Robert
(Kaysville, UT); Ehman; Michael Frederick (North Ogden,
UT); Harvey; Malcolm Randall (Hyde
Park, UT); Stephenson; James Craig
(Sandy, UT) |
Integrated inductive components and method of
fabricating such components |
6,241,587 |
6/5/01 |
Drill; Charles
Franklin (Boulder Creek, CA); Harvey; Ian Robert (Livermore, CA) |
System for dislodging by-product agglomerations
from a polishing pad of a chemical mechanical polishing machine |
6,236,222 |
5/22/01 |
Sur,
Jr.; Harlan (San
Leandro, CA); Harvey; Ian R.
(Kaysville, UT) |
Method and apparatus for detecting misalignments in
interconnect structures |
6,215,129 |
4/10/01 |
Harvey;
Ian Robert (Kaysville,
UT); Sethi; Satyendra
(Pleasanton, CA) |
Via alignment, etch completion, and critical
dimension measurement method and structure |
6,207,543 |
3/27/01 |
Harvey;
Ian Robert
(Kaysville, UT); Lin; Xi-Wei
(Fremont, CA) |
Metallization technique for gate electrodes and
local interconnects |
6,197,621 |
3/6/01 |
Harvey;
Ian R.
(Kaysville, UT) |
Custom laser conductor linkage for integrated
circuits |
6,174,803 |
1/16/01 |
Harvey;
Ian R.
(Kaysville, UT) |
Integrated circuit device interconnection
techniques |
6,162,650 |
12/19/00 |
Harvey;
Ian Robert
(Kaysville, UT); Sethi; Satyendra
(Pleasanton, CA) |
Via alignment, etch completion, and critical
dimension measurement method and structure |
6,084,305 |
7/4/00 |
Harvey;
Ian Robert
(Livermore, CA) |
Shaped etch-front for self-aligned contact |
6,080,677 |
6/27/00 |
Gabriel;
Calvin
(Cupertino, CA); Harvey; Ian Robert
(Livermore, CA); Leard; Linda (San Jose, CA) |
Method for preventing micromasking
in shallow trench isolation process etching |
6,060,376 |
5/9/00 |
Gabriel;
Calvin
(Cupertino, CA); Lin; Xi-Wei
(Fremont, CA); Zheng; Tammy (Fremont, CA); Leard; Linda (San Jose, CA); Harvey; Ian Robert (Livermore, CA) |
Integrated etch process for polysilicon/metal
gate |
6,057,227 |
5/2/00 |
Harvey;
Ian Robert
(Livermore, CA) |
Oxide etch stop techniques for uniform damascene
trench depth |
6,027,950 |
2/22/00 |
Harvey;
Ian Robert
(Livermore, CA); Gabriel; Calvin Todd
(Cupertino, CA) |
Method for achieving accurate SOG etchback selectivity |
6,013,558 |
1/11/00 |
Harvey;
Ian Robert
(Livermore, CA); Gabriel; Calvin Todd
(Cupertino, CA); Weling; Milind Ganesh
(San Jose, CA) |
Silicon-enriched shallow trench oxide for reduced
recess during LDD spacer etch |
6,008,130 |
12/28/99 |
Henderson;
David E.
(Fremont, CA); Harvey; Ian
(Livermore, CA) |
Polymer adhesive plasma confinement ring |
5,976,987 |
11/2/99 |
Harvey;
Ian Robert
(Livermore, CA); Gabriel; Calvin Todd
(Cupertino, CA); Bothra; Subhas
(San Jose, CA) |
In-situ corner rounding during oxide etch for
improved plug fill |
5,923,960 |
7/13/99 |
Harvey;
Ian Robert
(Livermore, CA) |
Method of making a custom laser conductor linkage
for the integrated circuits |
5,895,245 |
4/20/99 |
Harvey;
Ian Robert
(Livermore, CA); Lin; Xi-Wei
(Fremont, CA); Solis; Ramiro
(Bandera, TX) |
Plasma ash for silicon surface preparation |
5,880,006 |
3/9/99 |
Lin;
Xi-Wei (Fremont,
CA); Lee; Henry (San Francisco,
CA); Harvey; Ian R. (Kaysville,
UT) |
Method for fabrication of a semiconductor device |
5,821,163 |
10/13/98 |
Harvey;
Ian Robert
(Livermore, CA); Gabriel; Calvin Todd
(Cupertino, CA) |
Method for achieving accurate SOG etchback selectivity |
5,793,095 |
8/11/98 |
Harvey; Ian Robert (Livermore, CA) |
Custom laser conductor linkage for integrated circuits |